Mediatek has officially launched the new Helio G100 chipset. This comes after the Tecno Camon 30S Pro, the first phone to feature this chipset, made its debut. The Helio G100 is built using TSMC’s 6nm process.
According to the detailed specs shared by Mediatek, the Helio G100 is identical to the Helio G99. However, a notable upgrade is its support for 200MP main cameras. The Helio G100 is also designed to improve power efficiency, battery life, and connectivity.
The Helio G100 has an octa-core CPU with two 2.2 GHz Cortex-A76 cores and six 2.0 GHz Cortex-A55 cores. It uses LPDDR4X RAM and UFS 2.2 storage, common in most budget smartphones. The chipset supports a maximum display resolution of 2,520 x 1,080 pixels.
The Helio G99 remains a popular choice for mid-range smartphones in LTE markets due to its lower price compared to similar-performing Dimensity chipsets. The new Helio G100 offers the same competitive pricing. Over the past few years, camera capabilities have improved significantly, and the Helio G100 now supports a 200MP main camera. It can also handle a dual camera setup of 16+16MP and 32MP video capture at 30fps, a feature that was already available on the Helio G99.
The new Helio G100 introduces “Elevator Mode,” which quickly restores cellular connection after emerging from areas without coverage, such as tunnels or elevators. The chipset supports dual 4G SIM cards with both VoLTE and ViLTE capabilities.
Mediatek has already started supplying the Helio G100 to customers, so we can expect more smartphones to feature this chipset in the coming weeks and months.
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